Discharging heat out of today’s advanced computing solutions is more challenging than ever. That’s because more heat is generated by increasing levels of performance. But Mercury is up to the challenge.Introducing Our Latest Thermal Management Innovations
Mercury Systems’ industry-leading innovations in thermal management for air-cooled, conduction-cooled and VITA 48 subsystem chassis offer unprecedented levels of OpenVPX-slot cooling. And that means the heat is off prime contractors seeking to leverage high-performance, high-power sensor signal processing technologies.
Our new thermal management solutions are capable of transferring tremendous amounts of thermal energy at the component, module and subsystem level — while still meeting SWaP requirements for the overall solution.
Mercury’s improved air-cooled integrated XMC thermal solution addresses the need for a standards-based approach to draw heat away from today’s high-powered mezzanine cards, then onto the carrier module and ultimately out of the system. By adding “hooks” that connect to a thermal bridge between the card and module, the solution typically reduces mezzanine card temperatures by more than 5 degrees Celsius. This results in a five-times improvement in MTBF (mean time between failure), while remaining compliant with the VITA 48.1 mechanical specification for air cooling.
Our new conduction-cooled solution efficiently removes heat from mezzanine cards while staying within the ANSI/VITA 20 requirements for conduction-cooled PMCs. By leveraging flexibility built into the specification, Mercury’s advancement calls for the removal of the optional thermal ribs and the addition of a mezzanine cold plate that attaches to the carrier module. This creates a cooling area that’s up to six times the area of the legacy solution. Once implemented, maximum power levels of the mezzanine site that can be cooled are increased 15W per mezzanine site to an impressive 5W.
Mercury’s revolutionary Air Flow-By™ (AFB) cooling techniques for VITA 48.7/48.1 circuit card assemblies reduce module weight by more than 20 percent, reduce the power of a typical system by greater than 5 percent, and improve the MTBF by five times. The AFB covers wrap around existing modules to create a sealed environment for protection against dust and contaminants, Level-2 Maintenance and EMI. The specially designed enclosures draw heat from the internal components to the exterior surface, where air is flowed across both sides of the module for maximum cooling efficiency.
Innovations in Thermal Management
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