Embedded Processing Subsystems

Built for Today, Ready for Tomorrow

To deliver scalable, sustainable solutions capable of meeting your current and future needs, we use an open systems architecture approach. By combining elements from our portfolio of highly optimized COTS OpenVPX modules with customized electronics and rugged enclosures, we create customizable, embedded subsystems that are SOSA aligned for interoperability and rapid modernization.  

Our OpenVPX portfolio delivers all the pre-integrated, complementary modular blocks to place an entire data center onto any rugged platform. Using the same silicon, interconnect and software building blocks from commercial technology leaders, such as Intel and Nvidia, our portfolio can run any enterprise-class application that runs on commercial servers – often without recompiling the code.

Define the Optimal Design

Early engagement is key to designing and building a processing system that meets all your requirements, including cost and schedule needs. Leverage the industry’s most proven system integration experts and the widest portfolio of interoperable digital, RF and mixed signal system building blocks to quickly get up and running. 

Extend your capabilities by utilizing our engineering resources, fluent with your processes and tools. Our experts optimize your design and reduce program risk with advanced thermal, EMC, structural, signal integrity, safety critical, security, and SWaP-optimization modeling.

Premiere Program Management

From beginning to end, receive complete program transparency. Employing industry best practices, total lifecycle and risk management tools, your program manager oversees the verification, validation, qualification and acceptance testing of your system including third-party components. Your program manager works closely with engineering, manufacturing, supply chain, quality, test and contract review teams to identify and mitigate risk to your program.

Extreme Environmental Protection

For inhospitable locations, our MOTS+ packaging technologies use efficient conduction, air, liquid and hybrid cooling technologies; enhanced commercial components; board fabrication rules and subsystem design techniques to withstand extreme temperature cycles.