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Article: Redefining Sensor Edge Processing

February 24, 2021 Kristie Sombatphibane

Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.

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Article:  Agile IF Architectures Enable Flexible EW and ELINT Systems
Article: Agile IF Architectures Enable Flexible EW and ELINT Systems

Microwave Journal: Optimize the IF from mission to mission

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White Paper:  Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine ...